Universidade Federal do Rio Grande do Sul
Engenharia Elétrica
Circuitos Eletrônicos Integrados – ENG04061
Testes de Circuitos Eletrônicos Integrados
Stevan Silveira
Leandro Prytula
Argus Luconi Rosenhaim
Amkor Technology, Inc.
Site: www.amkor.com
Criação: 1968
Mercado: Worldwide
Empregados: 400 em Chandler, >22k worldwide
Localização:
Matriz: Chandler AZ – USA – Headquarters
Filiais: China, Japão, Coréia, Filipinas, Singapura e Taiwan.
Expansão: Vê a necessidade de aumentar a capacidade de
produção para atender os clientes.
Distribuição no mundo
Amkor Technology, Inc.
Dados de Vendas
Amkor Technology, Inc.
Principais clientes
Advanced Micro Devices, Inc.
Marvell Technology Group, Ltd.
Altera Corporation
Mediatek, Inc.
Analog Devices, Inc.
NEC Corporation
Atheros Communication, Inc.
NXP Semiconductors
Atmel Corporation
RF Micro Devices, Inc.
Avago Technologies, Pte
Samsung Electronics Corporation, Ltd.
Broadcom Corporation
Sony Semiconductor Corporation
Conexant Systems, Inc.
ST Microelectronics, N.V.
Freescale Semiconductor, Inc.
Texas Instruments, Inc.
IBM
Toshiba Corporation
Infineon Technologies
AG Qualcomm Incorporated
Intel Corporation
Xilinx, Inc.
LSI Corporation
Amkor Technology, Inc.
Serviços:
1. Testes de desenvolvimento: Abrange o desenvolvimento de
programas de teste, administração de projetos,
caracterização, prototipação.
2. Wafer Probe: Abrange a inspeção visual e teste elétrico do
wafer contra defeitos antes do encapsulamento.
3.Testes Finais: Processo de ensaio de cada aparelho/circuito
depois de ter sido encapsulado. Esse teste analisa os atributos
de cada dispositivo e determina se ele atende aos critérios
estabelecidos pelo cliente
* Os testes incluem circuitos digitais, lineares, sinais mistos,
memórias, rádio frequência (especialidade da empresa) e
integrações dessas tecnologias.
Amkor Technology, Inc.
Testes de desenvolvimento:
•Project management process(s)
•Rapid first article development
•Advanced wafer probe
•Low cost RF probe
•Hardware (contactor, load board, probe card, handler kits)
•Robust contacting solutions aligned with Amkor's bump and package
roadmap
•Novel test solution for low cost, bottom PoP (Package-on-Package)
•SiP module test strategies (including in-line test)
•Automation of system level test solutions
•Program conversion
•Multi-site test
•Strip test for punch and saw devices (low mix / high volume)
Amkor Technology, Inc.
Wafer Probe:
•High volume production test for 300mm,
200mm and 150mm wafers
•Full temperature range (-55oC to
+150oC)
•Thin wafer handling capabilities
• Electronic Assembly Support:
(<150um)
Die attach wafer mapping
•RF probe capabalities
(ALPS)
•DPS (Die processing services)
Edge dies exclusion
•Clean room environment
Wafer map template
•Multi-site probe
generation
•Probe card repair capabilities
Inkless probe
•Bake retention
Probe wafer mapping
•Bumped wafer probe
Amkor Technology, Inc.
Testes finais:
•High volume production final test
•Full temperature testing capabilities
•Yield and capacity analysis
•Highly skilled factory test engineering support
•Wide range of test and handling equipment
•Custom test processing - Commercial / Military flows
and mark after tests
•High volume strip test
Amkor Technology, Inc.
Equipamentos de teste
ATE
Verigy 93000
Advantest T2000
Teradyne Flex & UltraFlex
Teradyne Catalyst
Teradyne J750
LTX, CX & MX
Credence ASL3K, ASL1K
Eagle 364
Teradyne NexTest Maverick
Teradyne NexTest Magnum
Amkor RFT
LT / Duo / Quartet
Mixed
Signal
x
x
x
x
x
x
x
x
RF
x
x
x
x
Digital
x
x
x
x
x
Memory
x
x
x
x
x
x
x
Amkor Technology, Inc.
Testes completos
Comunicação:
•GPS, DVB-H, T-DMB, ISDBT receivers,
demods, base bands, SiP, SCSP
•Dual sided PoP ( package on package )
contactors, 2G / 3G baseband
•Advanced media processor SoC(s)
•Quadsite celluar Tx front end SiP modules
•GPS receiver and baseband
•BlueTooth SoC radio RF probe – WLCSP
die sales
•Multiple die / system in package solutions
for OEM(s)
•Cellular power amplifier + transceiver
modules, SiP, HEDGE
•LNA , Video Amplifiers & Drivers
•Noise cancellation
Consumidores:
•Biometric sensors, MEMS, Quad site
fingerprint sensor
•x16 Power FET & Op Amp solutions
•MOSFET strip test
•x32 Memory Card solutions
•LVDS timing controller LCD/PDP display
•Image stabilizer & processors, digital still
camera (DSC)
•USB2.0 / MP3 processor
•Hard disc controller
•Microcontrollers
•Compass IC
Wafer Inspection Services, Inc.
Site: www.waferinspectionservices.com
Local: Orleans MA - USA
Criação: 1986
Mercado: Worldwide
Empregados: < 50
Wafer Inspection Services, Inc.
Serviços:
•Audits
•Installations
•Deinstallations
•Operator Training
•Applications Training
•Technical Support
•Preventive Maintenance
•Maintenance Training
•Per Call Service
•Full time On Site Service
Wafer Inspection Services, Inc.
Serviços:
•NIST Calibration Wafers (PSLs)
•NIST Thin Films Calibration Wafers
•JDSU New Lasers
•SP2 remanufactured lasers
•Replacement Lamps
•Robotics service / repair
•PRI/Equipe, Ludl, Kensington
Maxtek Components Corp.
Site: www.maxtek.com
Local: Beaverton, OR – USA
Criação: 1970, juntamente com a Tektronix
Maxtek Components Corp.
Serviços:
•Package Design – Ensuring Your Product's Success
•Test Services – Verifying Your Component Performance
•Manufacturing – US-based Assembly of Your
Components
•Reliability & Failure Analysis – Identifying and
Eliminating Potential Failures
•Project Management – From Design to Finished
Component
BridgePoint Technical Manufacturing
Site: www.bridgept.com - em contrução
Local: Austin, TX - USA
BridgePoint Technical Manufacturing
Serviços:
•Test Development
•Product Engineering
•Probe/Final
Manufacturing Test
•Burn-in
•Custom device
programming, Inventory
•Electronic Assembly
•Product Analysis