I CM P98_. - INTERNATIONAL CONFERENCE ON MICROELECTRONICS AND PACKAGING
XIII SBMicro - INTERNATIONAL CONFERENCE ON
MICROELECTRONICS AND PACKAGING
ICMP'98
CURITIBA, PR - BRAZIL
August 10 to 14, 1998
PROCEEDINGS I
Technical Papers
UB/TIB Hannover
117018937
89
Edited by
Ivan Jorge Chueiri
Carlos Alberto dos Reis Filho
Organization
LACTRO - Coordenadoria de Eletronica
LAC - Laboratorio Central de Pesquisa e Desenvolvimento
Sponsors
SBMicro - Sociedade Brasileira de Microeletronica
IMAPS - International Society on Microelectronics and Packaging
T<
ICMP98 - INTERNATIONAL CONFERENCE ON MICROELECTRONICS AND PACKAGING
Summary
Analog Design -1
Session Chair
Gerson A. S. Machado
An IC for AC Motor Control
1
Luiz Otavio Rodrigues (in memoriam) and Armando Gomes da Silva Jr.
Motorola of Brazil. Brazil Design Center, Semiconductors Products Sector, Campinas, SP • Brazil
Statistical Design of a Transconductor Using a Low Voltage Low Power
Square-Law CMOS Cell
11
T. B. Tarim', H. H. Kuntman2 and M. Ismail'
1
Department of Electrical Engineering, Ohio State University, Columbus, Ohio • USA.
2
Department of Electronics Engineering, Instanbul Technical University, Instcnbul • Turkey
IF Stage and FM Demodulator IC
21
Ivan Carlos Ribeiro do Nascimento
Motorola of Brazil, Brazil Design Center, Semiconductors Products Sector, Campinas, SP - Brazil
A Highly-Linear VI Converter and a Precise Squarer Circuit for Low-Voltage
CMOS Applications
28
Chi-Hung Lin , T. C. Pimento and M. Ismail1
1
Department of Electrical Engineering, Ohio State University, Columbus, Ohio - USA.
1
Escola Federal de Engenharia de Itajubd, Itajuba. MG • Brazil
Miscellaneous
Session Chair
Jacobus Swart
Influence of the Substrate Temperature on the Raman Spectra of Diamondlike
Carbon Thin Films Produced by Sputtering
35
CAD system for analysis of wireless access passive SAW ID tags
41
M Massi', H. S. Maciel', L N. Nishioka', C. Otani', R D. Mansano' and P. Verdonck2
'Departamento de Fisica. Instituto Tecnologico de Aerondutica, Sao Jose dos Campos, SP - Brazil
'University of Sao Paulo. LSI - PEE - EPUSP, Sao Paulo, SP - Brazil
S. M Balashov, C. M. Cabreira and C Finardi
CPqD - Telebras, Campinas, SP - Brazil
A New Technology: Packing of Porous Silicon with Diamond
46
V. Baranauskm, B B Li, A. C.Peterlevitz. D C. Chang. andM. C. Tosin
Faculdade de Engenharia Eletrica e Computacao
UniversidadeEsradual de Campinas,
Av. Albert Einstein n'400. 11083-970 - Campinas-SP
A Methodology for Minimum Area Cellular Automata Generation
SO
PS Cardoso. M Strum. J R de Amazimasand W.J.Chau
Departamento de Engenharia Eletr&mca. Escola Politicnica - USP, Sao Paulo - Brazil
Hw-Sw Co-Design
Session Chair
Luigi Carro
Experiments on Using Colored Petri Nets as an Internal Model for Harware/Software Codesign of
Embedded Systems
Jaroslaw Mirkowski1 and Notion Marranghelto1.
' University of Newcastle - UK
2
University ofAarhus - Denmark
63
ICMP98 - INTERNATIONAL CONFERENCE ON MICROELECTRONICS AND PACKAGING
Chameleon: A Prototyping Platform for Digital System Design
71
M. E. de Lima, S. V. Cavalcante. C. C. de Aratljo and H. B. S. Ledo
Department of Informatics. Federal University ofPemambuco. Recife. PE - Brazil
The Hardware/Software Co-Design of an Intravenous Infusion Control System
78
M. V. D. dos Santos and E. Barros
Departamento de Informdtica, UFPE. Recife, PE - Brazil
Reliability-Oriented HW/SW Partitioning & Verification for Critical-Application Systems
85
F. Vargas. E. Bezerra. L Wulffand D. B. Junior
Catholic University - PUCRS, Porto Alegre, RS • Brazil
Fuzzy Logic & Neural Nets
Session Chair
Voldi C. Zambnedetti
Automatic Synthesis of Membership Functions Generators for Fuzzy Logic
95
Roberto d'Amore, Osamu Saotome and Karl Heinz Kienitz
lnstituto Tecnologico da Aerondutica, Sao Jose dos Campos. SP - Brazil
Signal Reconstruction of Tin Oxide Sensors with a Neural Network
102
G. Baratto and F. J. R.. Fernandez
Laboratorio de Microeletronica, USP, Sao Paulo, SP - Brazil
Architecture of a Fuzzy Logic Processor with Detection of Active Rules and Pipeline
110
Roberto d'Amore, Osamu Saotome and Karl Heinz Kienitz
lnstituto Tecnologico da Aerondutica. Sao Jose dos Campos, SP - Brazil
Winner-TakerAII Circuits Using CMOS Technology
116
Nobuo Oki
Universidade Estadual Paulista, Departamento de Engenharia EUtrica, Una Sotleira, SP - Brazil
Interconnect
Session Chair
Richard Ramos
Evaluation of Transistor Densities for Submicronic CMOS Technologies
123
F Moraes', L Torres2, M. Robert and D. Auvergne2.
; Catholic University - PUCRS, Porto Alegre, RS - Brazil
LIRMM, Mompellier - France
A Two Level Interconnection Process Using BCB Polymer as Interlevel Dielectric
131
Alexandre S. Lujan2. Jacobus W.Swart2 and Ricardo T. Yoshwka2
^ Grupo de Microeletronica de Marilia - Faculdade de Engtnharia - UNIMAR. Manila. SP - Brazil
DSIF-FEEC-Unicamp. Campinas. SP - Brazil
Packaging and Interconnect Innovation in Microsystems
138
J. M. Wilkinson
Technology for Industry, Ltd. Cambridgeshire - England
I44
Modeling Integrated Circuit Interconnections
R. Martins. W. Pyka. R Sabelka and S Selberherr
Institute for Microelectronics. TU Vienna • Austria
Micro-Electro-Mechanical Systems
Session Chair
Jose Camargo da Costa
Torsional Scanning Mirror Actuated Electromagnetic Induction and Acoustic waves
LuizOS. Ferreira'. FarzadPourlborz2andChantalKnanMalek2
i National Synchrotron Light Laboratory - LNLS. Campinas. SP - Brazil
Center for Advanced Microslructures and Devices - CAMD. Baton Rouge. LA - USA
XI
155
TPMPQ8 - INTERNATIQNAI CONFEREE ON MICRDFI FCTRONICS AND PACKAGING
Etching of deep trenches in silicon with inductively coupled plasmas
163
R. D. Mansano, P. Verdonck, and H. S. Maciel
LSI-PEEUSP. SSo Paulo - Brazil
Silicon Microstructures for Neuro-Electronics Applications
170
H. E. M. Peres. W. W. Leile, N. L V. Peixoto and F. J. R. Fernandez
Grupo de Sensores Integrdveis e Microestruturas. SIM. LME - USP, Sav Paulo - Brazil
Microfluidic Amplifiers Fabricated in Silicon Using Fluorine Based Plasma Etching Processe
175
E. W Simdes, R D. Mansano. R. Furlan and P. Verdonck
Laboratorio de Sistemas Integrdveis (LSI). Escola Politicnica - USP, Sdo Paulo - Brazil
Thin Film
Session Chair
Patrick Verdonck
Silicon Nitride Deposited by ECR-CVD on GaAs Substrates for Surface Passivation
and MIS Devices
185
/ A. Diniz. G. S. Lujan, P. J Tatsh andj. W. Swan
DSIF-FEEC-Unicamp. Campinas, SP - Brazil
Determination of The Optical Parameters of Semiconductor Thin Films
190
Gas Flow Simulation in a PECVD Reactor
194
C.L Garrido-Alzar '•'. J.EFandino2 and A.Martel2
1
Laboratorio de Microeletronica. Departamento de Engenharia Eletronica. UPUSP, Sdo Paulo, SP- Brazil
1
Laboratorio de Celdas Solares, DIEES-IMRE, Universidad de La Havana • Cuba
A. N. R. Silva and N. I. Morimoto
LSl-EPUSP. SdoPaulo, SP - Brazil
Effect of the Rapid Thermal Annealing Parameters on the Mechanical Stress and on the
Morphology of Titanium Silicide Films Formed onto Silicon Wafer Surfaces
202
S. G. de Souza. A. A. M. Lagand and S. G dos Santos Filho
University of Sdo Paulo. LSI - PEE - EPUSP. Sdo Paulo. SP - Brazil
Digital Design
Session Chair
Marius Strum
Rapid Design of Asynchronous Logic Using Reconfigurable Architectures
213
L Lloyd, K Htmn. A. M. Koelmans and A. V. Yakovlev.
Department of Computing Science,University of Newcastle upon Tyne • England
A Flexible Microprogrammable Controller for ATM Switch
221
Digital Circuit Design Using VHDL Description Synthesis
229
J.A.G. de Lima1, H S. da Silva'. A. C Cavalcanti' and E. U. K. Melcher2
' Departamento de Infomuilica Univtrsidade Federal da Paraiba.Campina Grande. PB - Brazil
2
Departamento de Engenharia Eletrica Universidade Federal da Paraiba, Campina Grande. PB - Brazil
F. L. Viana, F. Dumiani
DSIF/FEEC/UNICAMP
A CMOS Digital Pulse Width Modulator
236
Edison Ramalho and Jose" Antonio SiQueira Dias
DEMIC/FEEC/Unicamp. Campinas, SP - Brazil
Analog Design - II
Session Chair
Volnei Pedroni
A Low-Voltage Nano-to-Micro-Watt Class AB S2I Switched-Current Cell
Gerson A S. Machado
Technology for Industy. Cambridge • UK
xn
241
ICMP98 - INTERNATIONAL CONFERENCE ON MICROELECTRONICS AND PACKAGING
A Programmable Low Voltage Switched-Current FIR FUter for Disk Drive Equalization
F. A. Farag, C Galup-Montoro and M C. Schneider
LINSE-UFSC. Florianopolis. SC - Brazil
Simple Procedure for the Implementation of Resistor Arrays with Equivalent Resistance and
Temperature Coefficient
M. Gongora-Rubio' and C. S. Muranaka2
; Instiluto de Pesquisas Tecnologicas do Estado de Sdo Paulo. SP - Brazil
Laboatorw de Sistemas Integrdveis da EPUSP. Sdo Paulo, SP - Brazil
A Multi-Objective Optimisation Methodology Applied to the Synthesis of Low-Power
Operational Amplifiers
Ricardo S. Zebulum'2, Marco Aurelio Pacheco2 and Marley Vellasco2
^ Centre for Computational Neurosciences and Robotics (CCNR) Innovation Centre, University of Sussex. Brighton - UK
ICA - Nucleo de Inteligencia Computaaonat Aplicada. PUC - Rio de Janeiro. RJ - Brazil
249
256
264
Smart Sensors
Session Chair
Roberto A. Hexsel
Sensor and Amplifier non Linear Characteristics Compensation
Lulgi Carro, Gabriel Parmegianni Jahn
Departamento de Engenharia Eletrica, UFRGS. Porto Alegre. RS - Brazil
275
Enhanced Selectivity of Portable Tin Oxide Based Sensors Array for Brazilian Brandy
Identification
M. L B. P de la Vega. F. J. R Fernandez and G Baratto
Laboratorio de Microeletronica, Depanamento de Eletronica, Escola Politecnica da USP. Sao Paulo. SP - Brazil
A General Purpose Silicon Based Electrochemical Sensor - Development and
Characterization
MBA. Fames', R Furlan'. J. J. Sanatiago-Aviles2 and K. Araki'
; Laboratorio de Sistemas Integrdveis (LSI) - EPUSP. Sdo Paulo. SP - Brazil
^ University of Pennsylvania - USA.
lnstituto de Qulmica da Universidade de Sdo Paulo, SP - Brazil
283
291
Effective transmission and parameter optimizationof a twisted nematic liquid crystal display
I. H Vuolo. A. P Mammana
Instiluto de Flsica. USP. Sdo Paulo. SP - Brazil
Instiluto de Microeletronica. Centra Tecnoldgico para Informdlica. Campinas. SP - Brazil
299
Data Communication And Software
Session Chair
Luiz Sergio Zasnicoff
Design of a Master Unit for a Serial Data Communication Ring Network
Marcos Pelicia. Danielle Melo and Carlos A. dos Reis Fllho.
Laboratdrio de Pesquisa Magneti-Marelli da Unicamp - DSIFFEECUNICAMP. Campinas. SP • Brazil
305
El Add and Drop Integrated Circuit (TB47)
J Mouallen. J M Furtado Nelo. A.. M Brochi. R.C. Di Giorgio and MA Duarte Novo
CPqD • Telebrds. Campinas, SP • Brazil
310
Serial Communication Protocol for an In-Vehicle Wire Multiplex System
318
Carlos A. dos Reis Filho, Edevaldo P. da Silva Jr. Erico de L Azevedo. Jorge A. P. Semindrio. Leandro Dibb and Ricardo Maltione
Laboratdrio de Pesquisa Magneti-Marelli da Unicamp - DSIFFEECUNICAMP. Campinas. SP - Brazil
Dynamic Custom-Made Access to Courseware on the Web
Hans Liesenberg', Antonio Figueiredo2. Fdbio Lucena1 e Luiz Eduardo Buzalo'.
i IC-Unicamp. Campinas. SP - Brazil
Faculaade de Engenharia EUlrica e de Computacao. Campinas. SP - Brazil
UFG. Goiania. GO - Brazil
xm
323
ICMP98 - INTERNATIONAL CONFERENCE ON MICROELECTRONICS AND PACKAGING
Prototyping
Session Chair
Wilhelmus Van Noije
Methodology of Functional Qualification of Gate Arrays at IM/CTI
333
MBC. Pimentel. A.C.C Telles. M.D. Nardi
LACAM-1M • Fundacdo Centra Tecnologico para Informdlica - CTI. Campinas. SP - Brazil
Rapid Prototyping of Microcontroller Embedded Systems Using Esterel
340
M. S. de Queiroz. C. J. N. Coelho Jr.. D. C. da Silva Jr. and A. O. Femandes
DCC - Universidade Federal de Minos Gerais. Belo Horizonte. MG - Brazil
A Versatile and Cost-Effective PWB in COB Process Dedicated to ASIC Prototypes
348
M. T. Biasoli. S. Finco, P. E. de L. Vieira and D. Vigueiredo
LEE-IM - Fundacdo Cenlro Tecnologico para Informdlica - CTI, Campinas, SP • Brazil
Flux-Free Process for Placement and Attach of Solder Balls to Wafers, Flip Chips
and all BGA Packages
356
R. Ramos
Scientific Sealing Technology, Downey, CA - USA
Fabrication Process
Session Chair
Richard Anderson
Tuning of InGap/GaAs HBTs Fabrication Process
367
Deposition of Thick SiOxNy and SiO2 Films By PEC VD
373
Ricardo T. Yoshioka . Alexandre S. Lujan2. Jacobus W. Swart1, Jefferson Bellini3 and Mauro M. G. Carvalho1.
' DSIF-FEECUNICAMP. Campinas. SP-Brazil
2
GMMGrupo de Microeletronica de Manila - UNIMAR, Marilia. SP - Brazil
' LPD-IFGW-UNICAMP, Campinas. SP - Brazil
M.I.Alayo. I.Pereyra andM.N.P.CarreHo
Laboratdrio de Microeletronica da EPUSP, Sdo Paulo. SP • Brazil
The Defects Induced in Deep Regions by Ion-Implantation of BF2 and Effects of
the Annealing Temperature as Determined From the JxV Characteristics of pn Junctions
380
Development of a Low Temperature High Quality Silicon Oxide Deposition Process
388
M M. Oka'2. A. Nakada'2. Y Tamai'. T. Shibata' and T. Ohmi'
' Department of Electronic Engineering - Faculty of Engineering. Tohoku University. Sendai • Japan
2
Laboratory for Electronic Intelligent Systems, Research Institute of Electrical Communication. Tohoku University, Sendai - Japan
C. E. Viana and N. I. Morimoto
LSl-PEEEPUSP. Sdo Paulo. SP • Brazil
Smart Power
Session Chair
Ewaldo Luiz de Mattos Mehl
Semicustom Smart Power Design: A Novel Transistor Cell Architecture
395
Advanced Power Devices for Smart Power Integrated Circuits: The Trench Lateral DMOSFET's
403
A HDL-A Model of Power LDMOSFET Transistor for 2GHz RF Applications
410
A.P.Casimiro', S.Finco2, M.I.Castro Simas'JandF.Behrens4
lnstituto de Tetecomunicacoes. Lisboa - Portugal
2
IM - Fundacdo Cenlro Tecnoldgico para Informdtica - CTI. Campinas. SP - Brazil
Institulo Superior Ticnico. Lisboa - Portugal
4
PUCCAMP, Campinas. SP - Brazil
M. Zitouni'. F. Morancho'. H. Tranduc'. P. Rossel'. J. Buio2 and I. Pages1.
' LAASKNRS Toulouse, France
2
Motorola Inc. Semiconductor Products Sector. Austin, TX - USA
1
Motorola Semiconduaeun SA. Toulouse - France
t. Kouakou1. N. NoUUer1, P. Roaet H. Tranduc1 and P.Gola1.
' LAASKNRS. Toulouse. France
' RF Semiconductor Division, Motorola Semiconducteurs SA. Toulouse • France
xrv
ICMP98 - INTERNATIONAL CONFERENCE ON MICROELECTRONICS AND PACKAGING
An Integrated Circuit for Space Vector Modulation
S. Y C. Catunda. R. N. C. Alves. G. S. Deep. R. C. S. Freire and £. U. K. Melcher
UFPB/CCT/DEE. Campina Grande, PB - Brazil
415
Characterization and Test -1
Session Chair
Jose Henrique Vuolo
Analysis of the Electrical Characteristics of SiO2 Films Deposited by DPECVD
Marco I. Alayo and Ines Pereyra.
LME-EPUSP. Sdo Paulo. SP - Brazil
425
Photothermal Reflectance Microscopy Applied to the Study of Electrostatic Discharge
Degradation in MOSFET Structures
430
/ A. Batista', A. M Mansanares', E. C. da Silva', O J. Pagani Junior1, S. Eleulerio Filho2. M. B C Pimenlel' and N Jannuzv2
' IFGWUNICAMP. Campinas, SP- Brazil
lnstituto de Microeletronica / Fundacdo Centre Tecnologico para Informdlica CTI. Campinas. SP - Brazil
Raman Spectroscopy and AFM Analysis of Low Temperature nc-Si:H Films
E.A.T. Dirani'2. R M. Faria1. F J. Fonseca' and A. M. de Andrade'
' LME-PEE-EPUSP. Sao Paulo. SP - Brazil
2
Departamento de Fisica, Pontificia Universidade Caldlica de Sdo Paulo. Sdo Paulo. SP - Brazil
' lnstituto de Fisica - USP Sdo Carlos. Sdo Carlos. SP - Brazil
437
Boundary Scan - JTAG IEEE 1149.1 Standard A Review
A.M. Brocni
Telebras Research Center. Microelectronics Division, Campinas. SP - Brazil
442
POSTER SESSION
Session Chair
Furio Damiani
Design of Ternary Logic Circuits Using CMOS Technology
Maria Nidia R.D. Yacoub, Jose" A. Siqueira Dias and Alberto Martins Jorge.
DEMIC-FEEC-UNICAMP. Campinas. SP - Brazil
451
Fabrication Process For GaAs Metal Semiconductor Field Effect Transistors On Epitaxial Layers
454
Roberto R. Panepucci', Juliana C. Bueno'. Alexandre S. Lujan2. Jefferson Bellini', Mauro M.G. Carvalho' e Jacobus W. Swart'.
' LPD-IFGW-UNICAMP, Campinas. SP - Brazil
2
GMM/FE. UNIMAR. Marilia. SP - Brazil
A Submicron MESFET Process for Monolithic Integration with HBT Transistors
Alexandre S. Lujan', Jacobus W.Swart2 and Paul Enquisr1
' GMM/FE. UNIMAR. Marilia. SP - Brazil
2
LPD-IFGW-UNICAMP. Campinas. SP - Brazil
' RTI - Research Triangle Institute. RTP. NC • USA
457
The Design of a Fourth Harmonic Fluxgate Magnetometer
460
Juan Carlos Cruz and Hector Trujillo
Microelectronics Research Center. Elec. Eng. Faculty of the Superior Polylechnical Institute Jose~ A. Echeverria. Havana - Cuba
Signal Generator Cores for Mixed-Signal Systems-on-Chip
A. Susin' and G Roberts2
' DEE-UFRGS. Porto Alegre RS - Brazil
2
MCUDEE McGill University. Montreal. Quebec - Canada
463
Influence of the Substrate Type on the Surface Roughness of Titanium Silicide
A. N. R. Silva and N. M. Hasan
LSIPEEEPUSP. Sao Paulo. SP • Brazil
466
Universal Patterns Recognition
A. S. Oliveira, C. H. Menengrone and C. P. Santos
LPCI-IM-CTI. Campinas. SP - Brazil
469
MODI - A Visual Environment to Develop Systems Based on Microcontrollers
M. A. V. da Silva. A. H. de Sauza and EC. Ferreira
472
XV
ICMP98 - INTERNATIONAI CONFERENCE ON MICROELECTRONICS AND PACKAGING
DEMIC-FEECUNICAMP. Campinas. SP - Brazil
A New Technique to Obtain the MOS Gate Oxide Thickness and Electric Breakdown
Field Distributions from Fowler-Nordheim Tunneling Current
475
W. A. Nogueira and S. G. dos Santos Filho
LSI-PEEEPUSP. Sdo Paulo. SP • Brazil
Mechanical Stress and Morphology of Copper Thin Films Deposited by Electroless
Plating onto Si (100)
478
A. I. Hashimoto and S. G. dos Santos Filho
LSIPEE-EPUSP. Sdo Paulo. SP - Brazil
Argon Influence in the PETEOS Silicon Oxide Deposition Process
481
C. E. Viana. A. N. R. da Silva andN. I. Morimoto
LSI-PEE-EPUSP. Sdo Paulo. SP • Brazil
Optimization of the Twin Gate SOI MOSFET
484
P. T. Hoashi and J. A. Martino
LSIPEE-EPUSP. Sdo Paulo, SP - Brazil
Field Effect Transistor Using Poli(o-metoxyaniline) Films
487
R. K Onmori', C F. O. Graeff andR. M Faria1
' LME-PEEEPUSP. Sao Paulo. SP-Brazil
' Departamento de Fisica e Malemdlica, FFCLRP-USP. Ribeirdo Preto. SP - Brazil
' lnstituto de Fisica de Sdo Carlos - USP. Sdo Carlos, SP • Brazil
An Algorithmic Analog-to-Digital Converter Using Current Mode and Digital CMOS Process
490
Nobuo Oki and Jefferson D.B.Soldera
Universidade Esladual Paulista. DEE - llha Solteira, Sdo Paulo. SP • Brazil
Characterization and Test - II
Session Chair
Adney Melges de Andrade
Influence of the Titanium Deposition Procedures (Evaporation or Sputtering) on the
Morphology of Titanium Silicide Films Formed onto Si(100)
495
N. M. Hasan. A. A. M. Lagand and S. G. dos Santos Filho
LSI-PEE-EPUSP. Sdo Paulo. SP - Brazil
The Effect of Fluoridric Acid and Nitric Acid Treatment in As-Prepared Porous Silicon Layers
500
E. Galeazzo. A. Beltran. F. J
Grupo de Sensores Integrados e Micromecanismos SIM. LME-EPUSP. Sdo Paulo. SP - Brazil
Comparison Between Single and Double Langmuir Probe Techniques for Analysis
of Inductively Coupled Plasmas
508
R M de Castro, G. A. Cirino. P. Verdonck. H. S. Maciel. M. Massi. M. B. Pisani and R. D. Mansano
LSIPEE-EPUSP. Sdo Paulo. SP - Brazil
Depariamento de Fisica, Sao Josi dos Campos. SP • Brazil
Characterization of Porous Silicon By Photoluminescence, Ellipsometric and Micro-Raman
Spectroscopes
515
W. J. Salcedo'. F. J. ft. Fernandez1. Joel C. Rubim2. Uliane Souza1
' LME-EPUSP. Sao Paulo. SP - Brazil
2
lnstituto de Qulmica da Universidade de Sdo Paulo. Sao Paulo - Brazil
' lnstituto de Qulmica - USP. Sao Carlos SP - Brazil
Sigma-Delta A/D Conversion and Filter
Session Chair
Luiz OUvio Sarah/a Ferreira
A DeHa-Sigma A/D Converter with Current2 Switched Circuits
1
£ L Mendes'.O OUaei', P. Loumeau', R. C. S. Freirt and F. T. Brat
' EcoU National Smptrieun de ^communication. Paris - France
1
DEECCT-UFPB Campina Grande. PB - Brazil
XVI
525
ICMP98 - INTERNATIONAL CONFERENCE ON MICROELECTRONICS AND PACKAGING
Dependence of the Noise Shaping Filter Parameters and the Dynamic Range of
Sigma-Delta ADC's
528
George E. Bozinis and Carlos A. dos Reis Filho
DSIF-FEEC-UNICAMP. Campinas. SP - Brazil
Data Weighted Averaging Technique in Sigma-Delta Modulators
533
F. T. Braz'. P. Loumeau'. R C. S. Freire', and E. L. Mendes'
Electronics Department Ecole Nationale Superieure des Telecommunications. Paris - France
2
DEE-CCT-UFPB, Campma Grande. PB - Brazil
Programmable Filters Architectures for Image Processing
537
LTorres and M.Robert
Umversite Monlpellier II. Montpellier - France
Device Physics
Session Chair
Alafde P. Mammana
Effect of Lateral Electric Field in MOSFETs on Channel Mobility
543
Dennis Hoyniak'. Edward J. Nowak', Marisa Bauza2 and Richard Anderson*.
' IBM -USA
2
U. Buenos Ayres - Argentina
3
The University of Vermont. Burlington, Vermont- USA
Effect of the substrate Potential Drop in Accumulation-Mode SOI pMOSFET
Subthreshold Slope
549
M. A. Pavanello and J. A. Martino
LSI-PEE-EPUSP. Sdo Paulo. SP - Brazil
The Influence of the Back Gate Voltage on the Leakage Drain Current in Accumulation-Mode
SOI pMOSFETs at High-Temperatures
557
M. Bellodi andj. A. Martino
LSI-PEE-EPUSP. Sdo Paulo - Brazil
A New Method for Determination of the Oxide Charge Density at the Buried Oxide/Substrate
Interface in SOI Capacitor
564
V. Sonnemberg' and J. A. Martino2
1. FATEC. Sdo Paulo. SP - Brazil
2. LSI-PEE-EPUSP, Sdo Paulo. SP - Brazil
S71
AUTHORS
XVII
VTTT cDutron